Details
Title
A study on ceramic sintering preparation process and properties with the addition of silicon carbide foaming agentJournal title
Archives of ThermodynamicsYearbook
2025Volume
vol. 46Issue
No 1Authors
Affiliation
Qi, Haicheng : Henan Mechanical and Electrical Vocational College, Mount Taishan Road, Longhu Town, Xinzheng City, Henan 454000, ChinaKeywords
Silicon carbide ; Foaming agent ; Ceramics ; Sintering preparation ; Water absorption rateDivisions of PAS
Nauki TechniczneCoverage
135‒139Publisher
The Committee of Thermodynamics and Combustion of the Polish Academy of Sciences and The Institute of Fluid-Flow Machinery Polish Academy of SciencesDate
11.04.2025Type
ArticleIdentifier
DOI: 10.24425/ather.2024.152016Editorial Board
International Advisory BoardJ. Bataille, Ecole Central de Lyon, Ecully, France
A. Bejan, Duke University, Durham, USA
W. Blasiak, Royal Institute of Technology, Stockholm, Sweden
G. P. Celata, ENEA, Rome, Italy
L.M. Cheng, Zhejiang University, Hangzhou, China
M. Colaco, Federal University of Rio de Janeiro, Brazil
J. M. Delhaye, CEA, Grenoble, France
M. Giot, Université Catholique de Louvain, Belgium
K. Hooman, University of Queensland, Australia
D. Jackson, University of Manchester, UK
D.F. Li, Kunming University of Science and Technology, Kunming, China
K. Kuwagi, Okayama University of Science, Japan
J. P. Meyer, University of Pretoria, South Africa
S. Michaelides, Texas Christian University, Fort Worth Texas, USA
M. Moran, Ohio State University, Columbus, USA
W. Muschik, Technische Universität Berlin, Germany
I. Müller, Technische Universität Berlin, Germany
H. Nakayama, Japanese Atomic Energy Agency, Japan
S. Nizetic, University of Split, Croatia
H. Orlande, Federal University of Rio de Janeiro, Brazil
M. Podowski, Rensselaer Polytechnic Institute, Troy, USA
A. Rusanov, Institute for Mechanical Engineering Problems NAS, Kharkiv, Ukraine
M. R. von Spakovsky, Virginia Polytechnic Institute and State University, Blacksburg, USA
A. Vallati, Sapienza University of Rome, Italy
H.R. Yang, Tsinghua University, Beijing, China